JPH0321082B2 - - Google Patents
Info
- Publication number
- JPH0321082B2 JPH0321082B2 JP61299846A JP29984686A JPH0321082B2 JP H0321082 B2 JPH0321082 B2 JP H0321082B2 JP 61299846 A JP61299846 A JP 61299846A JP 29984686 A JP29984686 A JP 29984686A JP H0321082 B2 JPH0321082 B2 JP H0321082B2
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- resin
- joint
- wire
- thermistor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 50
- 239000011347 resin Substances 0.000 claims description 50
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 description 19
- 239000011247 coating layer Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000036760 body temperature Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29984686A JPS63153803A (ja) | 1986-12-18 | 1986-12-18 | 小型サ−ミスタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29984686A JPS63153803A (ja) | 1986-12-18 | 1986-12-18 | 小型サ−ミスタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63153803A JPS63153803A (ja) | 1988-06-27 |
| JPH0321082B2 true JPH0321082B2 (en]) | 1991-03-20 |
Family
ID=17877640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29984686A Granted JPS63153803A (ja) | 1986-12-18 | 1986-12-18 | 小型サ−ミスタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153803A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5163057B2 (ja) * | 2007-10-31 | 2013-03-13 | Ｔｄｋ株式会社 | サーミスタ |
| JP6992442B2 (ja) * | 2017-11-24 | 2022-01-13 | 株式会社デンソー | 温度センサ |
-
1986
- 1986-12-18 JP JP29984686A patent/JPS63153803A/ja active Granted
Non-Patent Citations (1)
| Title |
|---|
| PTC THERMISTORS SUMMARY CATALOGUS=1982 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63153803A (ja) | 1988-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6498561B2 (en) | Thermistor and method of manufacture | |
| JP2839739B2 (ja) | 抵抗素子 | |
| JPH0321082B2 (en]) | ||
| JPS63234122A (ja) | サ−ミスタ | |
| JP6959573B2 (ja) | 樹脂封止型電子部品 | |
| CA2368337C (en) | Thermistor and method of manufacture | |
| JP3152352B2 (ja) | サーミスタ素子 | |
| CN203118696U (zh) | 一种片式热敏电阻器 | |
| CN2262278Y (zh) | 微型ntc热敏电阻 | |
| KR200167234Y1 (ko) | 적층형칩을내장한엑씨얼타입엔티시써미스타 | |
| JPS6234269Y2 (en]) | ||
| JPH04298002A (ja) | 樹脂封止形サーミスタ | |
| JPH0548106Y2 (en]) | ||
| JPS61259508A (ja) | サ−ミスタ | |
| JPH02159247A (ja) | 血流測定用カテーテル | |
| JPS5974688A (ja) | ポリ四フツ化エチレン被覆熱電対およびその製造法 | |
| JPH0311842Y2 (en]) | ||
| JPH01293504A (ja) | ガラス封入形サーミスタの製造法 | |
| JP2002353004A (ja) | 温度検知用ｎｔｃサーミスタ | |
| JPH0850062A (ja) | 温度検知器 | |
| JPH11132866A (ja) | サーミスタ温度センサ | |
| JPH05258909A (ja) | ガラス封入形サーミスタ | |
| JPH0582004U (ja) | サーミスタ素子 | |
| KR200333196Y1 (ko) | 이중보호막을 갖는 서미스터 | |
| CN115435917A (zh) | 一种温度传感器及制备方法 |